| Process capabiligy |
Max. panel size:650mm*510mm
Min. components size:01005
SMT Mouting precision:+/-0.22um |
Max. components size:200mm * 125mm
Min. BGA pitch:0.25mm |
| Advanced process Technology |
SMT through-hole reflow soldering process
Conformal coating
Lead/lead free reflow soldering process
Wave soldering process
BGA automatic repair process |
Red glue printing soldering process
Automatic cleaning process
Lead/lead-free wave soldering process
High-precision press-fit technology |
| Test |
On-line solder paste inspection
Function test
X-ray |
AOI automatic test
ICT test
Reliability test |
